2 67 150 c 5 minutes part a 2 03 120 c 15 minutes part b 3 07 80 c 3 hours. 1 1 ratio general properties 100 solids two component silver filled epoxy with a soft smooth thixotropic becoming less viscous when stirred or shaken consistency designed specifically for chip bonding in microelectronic and optoelectronic applications. Epo tek h20e is a two component 100 solids silver filled epoxy paste designed specifically for chip bonding in microelectronic and optoelectronic applications.
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